Electromagnetic Characterization Analysis of the Connecting Structure of the Via in Multilayered Microwave Circuit

摘要

Via hole is frequently applied in multilayer micro-wave circuit interconnection. As the discontinuity of via,it causes more reflection and radiation when frequency becomes higher.Therefore,electromagnetic characterization analysis of via is important in the design of microwave circuit. The paper presents the electromagnetic modeling method of via based on the principle of microwave network in multilayer microwave circuit.To achieve the simplification,the authors decompose the overall structure into several substructures,then,Matrix-Penciled Moment Method and microwave network theory are used to analyze each substructure.