Superconformal Electrodeposition of Silver from a Cyanide-free Bath for on-chip Metallization

摘要

A cyanide-free plating bath was used for the superconformal deposition of silver into fine trenches. It shows that in thiosulfate silver plating bath, cysteine as an additives adsorbed on silver electrode surface could enhance the polarization of silver deposition and suppress silver deposition rate. Trenches with 300 nm in width were void-freely filled in this bath.