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Single Asperity Tribochemical Wear of Silicon by Atomic Force Microscopy

机译:原子力显微镜对硅的单次摩擦摩擦化学磨损

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We report measurements of single asperity wear on oxidized silicon surface in aqueous KOH using atomic force microscopy (AFM), where the single crystal silicon tip was used both to tribologically load and image the surface. AFM was also operating in the lateral (frictional) force mode (LFM) to investigate the pH dependence of kinetic friction between the tip and the SiO_2 surface. We found that the Si tip wear amount strongly depended on the solution pH value and was at a maximum at around pH 10. It was also found that the Si removal volume in moles was approximately equal to that of SiO_2 irrespective of the solution pH value. This equality implies that the formation of the Si-O-Si bridge between one Si atom of the tip and one SiO_2 molecule of the specimen at the wear interface, followed by the oxidation of the Si surface, finally the bond rupture by the tip movement, the dimeric silica (OH)_3Si-O-Si(OH)_3, including the Si-O-Si bridge is dissolved in the KOH solution. It was also found the frictional force is highly sensitive to the pH values of the solution and peaked at around pH 10. These results indicate that the interfacial reaction would be affected by the frictional force between the Si tip and the SiO_2 surface, due to an increased liquid temperature and a compressive stress in Si and SiO_2 networks. Strong influence is observed by the pH of the ambient solution confirming the important role of the OH- in the wear mechanism. We present a microscopic removal mechanism which is determined by an interplay of the diffusion of water in Si and SiO_2.
机译:我们使用原子力显微镜(AFM)报告了在水性KOH中氧化硅表面上单次粗糙磨损的测量结果,其中单晶硅尖端既用于摩擦学加载,又用于表面成像。 AFM还以横向(摩擦)力模式(LFM)运行,以研究尖端与SiO_2表面之间的动摩擦的pH依赖性。我们发现,Si尖端的磨损量在很大程度上取决于溶液的pH值,并且在pH约为10时最大。此外,还发现与溶液的pH值无关,以摩尔计的Si去除量大约等于SiO_2的去除量。这种相等性意味着在磨损界面处,尖端的一个Si原子与样品的一个SiO_2分子之间形成了Si-O-Si桥,随后Si表面被氧化,最终由于尖端的运动而使键断裂然后,将包括Si-O-Si桥的二聚二氧化硅(OH)_3Si-O-Si(OH)_3溶解在KOH溶液中。还发现摩擦力对溶液的pH值高度敏感,并在pH约为10时达到峰值。这些结果表明,由于硅尖和SiO_2表面之间的摩擦力,界面反应会受到影响。 Si和SiO_2网络中液体温度的升高和压缩应力。通过环境溶液的pH值可以观察到强烈的影响,从而证实了OH-在磨损机理中的重要作用。我们提出了一种微观去除机理,该去除机理是由水在Si和SiO_2中的扩散相互作用决定的。

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