首页> 外文会议>Journal of Thermal Spray Technology >Erosion Properties of Plasma Sprayed Ceramic Coatings againstProcess Plasma in Semiconductor Production Equipment
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Erosion Properties of Plasma Sprayed Ceramic Coatings againstProcess Plasma in Semiconductor Production Equipment

机译:等离子喷涂陶瓷涂层对半导体生产设备中工艺等离子体的冲蚀性能

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Erosion properties of high purity alumina (Al2O3) and yttria(Y2O3) coatings prepared by plasma spraying have beeninvestigated against process plasma in semiconductor andliquid-crystal-display (LCD) production equipments for dryetching. Studies on plasma power dependency have revealedthat yttria coatings have showed higher anti-plasma erosionresistance than alumina coating as well as sintered aluminabulk at every condition. Although yttria coatings are inferiorto sintered yttria bulk, the difference of the resistance becomessmaller with increasing plasma power. This result positivelypromotes the application of the yttria spray coating because ofincreasing plasma power in actual process.Erosion properties of the coatings against Ar/CF4/O2 plasma,whose composition is increasingly being used in commercialprocess, are also investigated where physical etching effectbecomes stronger than the typical CF4/O2 case. It has beenfound that order of durability (yttria bulk > yttria coatings >alumina bulk > alumina coating) is independent of the gasspecies used in this study. The mechanism of the plasmaerosion is discussed through micro-structural analysis of theeroded surfaces.
机译:高纯氧化铝(Al2O3)和氧化钇的冲蚀性能 已经通过等离子喷涂制备了(Y2O3)涂层 针对半导体中的工艺等离子体进行了研究 干式液晶显示(LCD)生产设备 蚀刻。有关等离子功率依赖性的研究表明 氧化钇涂层显示出更高的抗等离子腐蚀 电阻比氧化铝涂层以及烧结氧化铝 在任何情况下都散装。尽管氧化钇涂层较差 到氧化钇块的烧结,电阻的差变为 随着等离子功率的增加而变得更小。这个结果肯定 促进氧化钇喷涂的应用,因为 在实际过程中增加等离子功率。 涂层对Ar / CF4 / O2等离子体的冲蚀性能, 其成分正越来越多地用于商业 工艺,还研究了物理蚀刻效果 变得比典型的CF4 / O2外壳更坚固。它一直 发现耐久性顺序(氧化钇块>氧化钇涂层> 氧化铝块>氧化铝涂层)与气体无关 本研究中使用的物种。等离子体的机理 侵蚀通过微观结构分析来讨论。 腐蚀的表面。

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