In this paper, copper coatings were deposited on a metallicsubstrate by means of multi-function micro-plasma sprayingunder different processing parameters. The microstructure andphase structure of copper coatings were investigated using ascanning electron microscope and X-ray diffraction, bondingstrength were tested by an electron tensile tester, dropletimpinging and flattening on a flat substrate surface and theresidual stress after solidification were studied numerically.The experimental results show that the density of coppercoatings was improved with increasing plasma power andoperating gas flow, and this copper coating possessed highadhesion strength and low residual stress, still without obviousoxidation. This spraying system extends the application fieldof tradition plasma spray. Through changing the processingparameters, materials with different melting points, even aslow as copper can be produced.
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