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mPL6

机译:mPL6

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摘要

The most recent version of the mPL multilevel placement algorithm, mPL6, is reviewed. This version is derived from the mPL5 placer (ISPD05) and the Patoma floorplanner (ASPDAC05). It is also augmented by new techniques for detailed placement. As a result, it can handle mixed-size placement very effectively. First-choice clustering is used to construct a hierarchy of problem formulations. Generalized force-directed placement guides global placement at each level of the cluster hierarchy. Prior to interpolation of each coarse-level solution to its adjacent finer level, however, recursive, top-down displacement-minimizing floorplanning optimizes block orientations and checks that overlap can be removed at the current level. Where necessary, the floor-planner perturbs coarse-level solutions enough that legalization of the given placement can be assured. The resulting flow is scalable and robust, and it produces very low-wirelength solutions for known benchmark circuits.
机译:审查了最新版本的mPL多级放置算法mPL6。此版本源自mPL5布局器(ISPD05)和Patoma布局规划器(ASPDAC05)。还通过新技术对详细放置进行了增强。结果,它可以非常有效地处理混合尺寸的放置。首选聚类用于构建问题表述的层次结构。广义的力导向放置指导群集层次结构每个级别的全局放置。但是,在将每个粗糙级别的解决方案内插到其相邻的更高级之前,递归,自上而下的位移最小化布局可以优化块的方向,并检查是否可以在当前级别上消除重叠。必要时,平面布置图人员会干扰粗略的解决方案,以确保给定布局的合法性。由此产生的流程具有可扩展性和鲁棒性,并且为已知的基准电路提供了非常低的线长解决方案。

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