DISPLACEMENT AND STRAIN ANALYSIS IN A NON HOMOGENEOUS MATERIAL

摘要

Electronic holography moire is applied to the measurement of interfacial conditions between particle and matrix in a non homogeneous rubber material. A tensile specimen is subjected to creep loading. The loads are applied in steps and measurements are carried out at equal intervals of time. The final output is provided by the Holo-Moire Strain Analyzer and gives the principal strains and their directions in the region of observation. A definition of adhesion as an experimental measurable quantity through the evaluation of contour integrals is introduced.