gold; gold alloys; palladium alloys; platinum alloys; copper alloys; sputtered coatings; microswitches; electrical contacts; contact resistance; microswitches; electric contacts; analytic model; microcontact resistance; microelectromechanical systems design; microelectromechanical systems fabrication; microelectromechanical systems testing; metal contact switches; sputtered bimetallic contact; binary alloy contacts; switching lifetime; 1 to 2 ohm; 0.2 to 1.8 ohm; Au; AuPd; AuPtCu; Au-AuPt;
机译:带有溅射Au,AuPd,Au-on-AuPt和AuPtCu合金电触点的微动开关
机译:摘要摘要:离子溅射对Au / n-GaAs(100)肖特基接触件的界面化学和电性能的影响
机译:熔化,粗糙度和接触电阻对与GaAs / AlGaAs多层结构形成合金的AuGe / Ni / Au型电触点中Ge和Ni含量的依赖性
机译:带有溅射的Au,AUPD,Au-On-anupt和Au-On-Autoy电触点的微开关
机译:带有金属合金电触点的静电射频(RF)微机电系统(MEMS)开关。
机译:极化偏压和多孔硅形态对金-多孔硅触点电性能的影响
机译:屏蔽技术通过溅射沉积石墨烯的电触点