Electromagnetic noise mitigation in high-speed printed circuit boards and packaging using electromagnetic band gap structures

摘要

In this work, we discuss the novel concept of using metallo-dielectric electromagnetic bandgap (EBG) structures to address critical electromagnetic noise problems in high-speed circuits, packages and boards. Various design techniques for these structures, when embedded in a parallel metallic-plate structure, are presented and their efficacy and preciseness are compared. An accurate physics-based model for the unit cell of these surfaces is introduced and its accuracy is compared with simulations and measurements. It is shown that the behavior of the EBG structures in PCBs is like a low-impedance surface rather than a high-impedance surface. In particular, novel concepts presented in recent works are being used to show the validity of this observation and the effectiveness of the physics-based model to model the new concepts and applications. Finally, a new technique for the reduction of electromagnetic interference in packages using EBG structures is introduced and numerical simulations are used to show the mechanism of such interference reduction.