High-speed electroabsorption (EA) modulator modules using the flip-chip bonding (FCB) technique

摘要

We have developed the EA-modulator modules with over 40-GHz modulation bandwidth using the FCB technique. Using the FCB, the parasitic inductance and the module-to-module variations in electrical characteristics can be greatly reduced as compared with that using the wire bonding. We also showed the FCB technique indispensable to high-speed EA-modulator modules for 80 Gbit/s and higher bit-rates.