A wafer-based fabrication process used to produce surface-relief microlenses for telecommunication applications is presented. Anamorphic and aspheric collimating lens profiles can be achieved, and samples have been measured to achieve insertion losses less than 0.2 dB/pair.
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机译:提出了一种用于生产用于电信应用的表面浮雕微透镜的基于晶片的制造工艺。可以实现变形和非球面的准直透镜轮廓,并且已经对样品进行了测量,以使其插入损耗小于0.2 dB /对。
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