New coupled-field device simulation tool for MEMS basedf on the TP2000 CAD platform

摘要

we describe and demonstrate the capabilities of a new coupled field simulator abased on the industrial CAD platform TP2000 for the multidimensional numerical analysis of the operation of electro-mchanical microderives. The coupling of the finite element and the boundary element methods makes the simulaton tool patticularly usited for microdevices where movable parts are deflected, displaced, or rotated by electrostatic forces. As an illustrative example, we study the fully cupled electro-mechanical behavior of a deflectable micromirror.