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Kinetics of the Growth of Copper Clusters on the Alumina (0001) Surface: Influence of Surface Structure

机译:氧化铝(0001)表面上铜团簇生长的动力学:表面结构的影响

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The kinetics of the growth of copper clusters on the alumina (0001) surface was studied as a function of surface structure, using EXAFS at the Cu K edge. Equivalent cu coverages ranging from 0.5 to 4 equivalent monolayers were deposited in situ, at room temperature, on alumina (0001) surfaces exhibiting the (1x1) or the (sq root 31 x sq root 31)R9 deg reconstructed structure. The evolution of mean cluster size with deposition time was followed from the mean Cu coordination number in the clusters deduced from the EXAFS data. The increase of the mean cluster radius with deposition time is characteristic of a coalescence mechanism on both surfaces. The growth is quicker on the reconstructed surface, likely due to different surface diffusion properties of both surfaces.
机译:使用Cu K边缘的EXAFS研究了氧化铝(0001)表面上铜团簇的生长动力学与表面结构的关系。在室温下,在具有(1x1)或(sq根31 x平方根31)R9 deg重构结构的氧化铝(0001)表面上原位沉积0.5至4当量单层的当量cu覆盖率。根据从EXAFS数据推导出的团簇中的平均Cu配位数,追踪了平均团簇尺寸随沉积时间的变化。平均簇半径随沉积时间的增加是两个表面上的聚结机制的特征。可能是由于两个表面的表面扩散特性不同,所以在重建的表面上生长更快。

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