首页> 外文会议>Conference on micromachined devices and components >Integrated mixed-technology design environment to support micro-electro-mechanical systems development
【24h】

Integrated mixed-technology design environment to support micro-electro-mechanical systems development

机译:集成的混合技术设计环境,支持微机电系统的开发

获取原文

摘要

Abstract: A major hurdle to the development of Micro ElectroMechanical Systems (MEMS) resides on the lack ofcommunication link between the mechanical (or physical)world and the electronic world. Within a developmentphase, each team handles the tools traditionally usedin its disciplines without any common interface. Whenusing field solvers, e.g. finite element methods, MEMSengineers identify material properties and boundaryconditions, and built a mesh, so the tool can run a 3Dfinite elements solution. The tool can predict theamount of stress and strain in the structures, themovement or any other interesting characteristics, butnone of this information can be automaticallytransferred to an IC design tool. In addition, thestraightforward advances within the latest developmentsof the mainstream semiconductor industry is the use ofalready available intellectual property (IP) in thedevelopment of systems optically matched to the endproduct specifications. These prospects call for a newgeneration of design tools that combines aspects of EDAand mechanical/thermal/fluidic CAD. The new productsuite presented in this paper offers an integratedsolution allowing a continuous design flow fromfront-end to back- end. The end objective is to bringto the system level designer, a complete design flow,down to the chip level, anchored on design re-use andreliable system-level simulation, thus leveragingstandard IP products for the realization ofsophisticated miniature systems, at low cost.!10
机译:摘要:微机电系统(MEMS)的发展主要障碍在于机械(或物理)世界与电子世界之间缺乏通信联系。在开发阶段,每个团队无需任何通用界面即可使用其学科中传统上使用的工具。使用场求解器时,例如在有限元方法中,MEMS工程师识别出材料属性和边界条件,并建立了网格,因此该工具可以运行3D有限元解决方案。该工具可以预测结构中的应力和应变量,运动或任何其他有趣的特征,但是这些信息都不能自动传输到IC设计工具中。另外,在主流半导体工业的最新发展中的直接进步是在光学上与最终产品规格匹配的系统的开发中使用了已经可用的知识产权(IP)。这些前景要求新一代设计工具将EDA与机械/热/流体CAD结合在一起。本文介绍的新产品提供了一种集成解决方案,允许从前端到后端的连续设计流程。最终目标是将完整的设计流程(降低到芯片级)引入系统级设计人员,并依赖于设计重用和可靠的系统级仿真,从而利用标准IP产品以低成本实现复杂的微型系统! 10

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号