A multi-head, single platen (MHSP) CMP tool is the most effective approach in achieving the lowest cost of ownership for the chemical mechanical polishing process. The CMP process appears to be non-sensitive to slurry flow in a multi-head CMP tool. Multi-head polishing on a single platen with slurry usage of 50 C.C./Min. per water has demonstrated optimum process performance for oxide CMP. Footprint is another big advantage of a MHSP CMP tool. The highest wafer throughput per hour per square foot can be achieved using the MHSP design. The lowest C.O.O. can therefore be realized using the MHSP tool design if the CMP process capability can be proved. Cybeq Nano Technologies has developed a MHSP CMP tool. The tool has demonstrated process capability comparable to that of a single head tool. Some of the process advancement is consumable dependent. However, it can be stated confidence that all the traditional CMP processes previously carried out on single wafer CMP Tools can be executed with confidence in a MHSP Tool. Cybeq's IP 8000 MHSP CMP tool, has been proven for high volume manufacturing of multi-layer matallization devices. Shallow trench isolation (STI) is a new application of CMP technology. High selectivity of oxide to nitride slurry has been evaluated and the data showed potential significant advantage of using the new slurry for shallow trench isolation (STI).
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