首页> 外文会议>Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1998. Technical Digest 1998., 20th Annual >LSI capability demonstration of an 0.15 /spl mu/m-0.3 /spl mu/m GaAs HEMT and PM-HEMT 3 level metallization E/D-technology for mixed signal circuits
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LSI capability demonstration of an 0.15 /spl mu/m-0.3 /spl mu/m GaAs HEMT and PM-HEMT 3 level metallization E/D-technology for mixed signal circuits

机译:LSI演示0.15 / spl mu / m-0.3 / spl mu / m GaAs HEMT和PM-HEMT 3级金属化E / D技术的混合信号电路

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摘要

A 16/spl times/16 bit parallel multiplier based on a 26 k sea-of-gates has been fabricated successfully to demonstrate the LSI capability of our mixed signal IC technology including pseudomorphic T-gate HEMTs for high speed as well as three levels of gold metallization for high integration complexity. To prove the high speed performance, a digital dynamic frequency divider operating in a frequency band from about 36 GHz up to almost 60 GHz has been realised.
机译:已成功制造出基于26 k门逻辑的16 / spl次/ 16位并行乘法器,以证明我们的混合信号IC技术的LSI能力,包括用于高速伪三态T门HEMT以及三种电平的金金属化工艺,具有很高的集成复杂度。为了证明高速性能,已经实现了在大约36 GHz至大约60 GHz频带内工作的数字动态分频器。

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