In-situ measurements of thermal properties of dielectric films in metal-dielectric-substrate structures

摘要

We show that the thermal diffusivity of a dielectric film and the heat-transfer coefficient between the film and the substrate to which it is adhesively bonded can be determined from the electret-like response stimulated by laser applied to the voltage-biased dielectric. The temperature profile is calculated as a function of time from the heat-conduction equation with boundary conditions appropriate for the model structure representing the metallic electrode/dielectric film/glue layer/ substrate structure. The electrode, acting as a thermal mass, and the substrate, acting as a thermal sink, affect temperature profile in different time ranges.