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Photoresist-free microstructuring of III-V semiconductors with laser-assisted dry-etching ablation

机译:激光辅助干法刻蚀对III-V半导体进行无光刻胶的微结构化

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Abstract: The progress in manufacturing of integrated microelectronic and optoelectronic devices requires new technologies which would make possible printing of nanometer-size features and/or which would offer cost effective solutions in the fabrication of micrometer-size devices. Laser-induced direct (photoresist-free) patterning of materials has been recently investigated as a method that has some potential in that area. We have applied laser-assisted dry etching ablation for contact, proximity and projection mask lithography of III-V semiconductor films, quantum wells and superlattices. It has been shown that micrometer-size structures of those materials can be directly fabricated following the exposure to an excimer laser radiation in an atmosphere of chlorine diluted in helium. The results indicate that the process has the potential for the fabrication of high-quality quantum wire and quantum dot structures.!15
机译:摘要:综合微电子和光电器件制造的进展需要新技术,这将使纳米尺寸特征的印刷和/或将在微米尺寸装置的制造中提供成本有效的解决方案。最近被研究的激光诱导的直接(无光致抗蚀剂)图案化作为该区域具有一些潜力的方法。我们已经应用了III-V半导体膜,量子孔和超晶片的接触,接近和投影掩模光刻的激光辅助干蚀刻消融。已经表明,在暴露于在氦气中稀释的氯气气氛中暴露于准分子激光辐射之后,可以直接制造这些材料的微米尺寸结构。结果表明,该过程具有高质量的量子线和量子点结构的制造。!15

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