A powerful EM analysis tool based on the FD-TD simulation method

摘要

Packaging and interconnects not only impact the functional characteristics (the ability and speed with which a given inpnt signal may be modified to some desired and appropriate output signal) of a product, but also how the product performs in any number of applications. These applications can range from military and automotive environments where mechanical integrity must be maintained as well as an ability to operate over a wide margin of temperature extremes. In power distribution appliactions impedance must be kept to a minimum; board layout and packaging have a significant impact in the impedance levels. Further, higher power densities, found in circuits which have increasing device and board densities, must be managed to prevent system failure.