622 Mbit/s board-to-board link in 0.5 μm CMOS technology

摘要

High speed digital processing chips demand also high speedinterconnections. On-board communication with a limited distance havealready been realised. However in this paper an inter boardcommunication over a relative long distance is presented. To minimisesignal reflections in this kind of communication networks a specialtermination circuit has been developed. This impedance termination canbe tuned to match the characteristic impedance of the transmission wire.Using this termination circuit a driver and receiver are designed.Transmission rates up to 800 Mbit/s have been measured. The two boardsare connected to each other with a twin ax shielded wire plugged in thebackplane connector of the two PCBs. To allow integration with thedigital processing chips a standard CMOS process is used to realise thedriver and receiver chips