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High-resolution CCD linear image sensors for the advanced visible and near-infrared radiometer (AVNIR)

机译:适用于高级可见光和近红外辐射计(AVNIR)的高分辨率CCD线性图像传感器

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Abstract: Two types of high resolution CCD linear image sensors have been developed for AVNIR, which will be carried on the Advanced Earth Observing Satellite (ADEOS) in early 1996. One has 10000 pixels (pixel size: 8 $mu@m $MUL 8 $mu@m) with spacing of 8 $mu@m for the panchromatic band (0.52 - 0.69 $mu@m). The other has 5000 pixels (pixel size: 16 $mu@m $MUL 16 $mu@m) with spacing of 16 $mu@m for the multispectral bands (Mu1: 0.42 - 0.50 $mu@m, Mu2: 0.52 - 0.60 $mu@m, Mu3: 0.61 - 0.69 $mu@m, and Mu4: 0.76 - 0.89 $mu@m). These bands are separated by a dichroic prism in the optical system. Each sensor has a staggered layout of Si p-n-p buried photodiodes, and an overflow drain for an anti- blooming and an electronic shutter operation. The sensor for the multispectral band (MU) has 2 CCDs and the sensor for the panchromatic band (PA) has 4 CCDs to reduce operating frequency. To prevent degradation of modulation transfer function (MTF) for the Mu4 band, which is a near-infrared region, we used a staggered arrangement and p$+$MIN$/ on p$+$PLU$/ epitaxial wafers. MTF in Mu4 band is 0.62 and 0.80 at Nyquist frequency (fn) and $HLF fn, respectively. We have developed novel packaging technologies so as to obtain a focal plane flatness of less than 10 $mu@m peak-to-peak. These technologies include a newly developed SiC-Al$-2$/O$-3$/-SiC package and a method to correct a warp of the chip surface. !4
机译:摘要:已经为AVNIR开发了两种类型的高分辨率CCD线性图像传感器,将于1996年初在高级地球观测卫星(ADEOS)上搭载。一种具有10000像素(像素大小:8 $ mu @ m $ MUL 8全色谱带的间距为8μm@ m)(0.52-0.69μμm)。另一个具有5000个像素(像素大小:16 $ mu @ m $ MUL 16 $ mu @ m),多光谱带的间距为16 $ mu @ m(Mu1:0.42-0.50 $ mu @ m,Mu2:0.52-0.60 (μm),Mu3:0.61-0.69μm,和Mu4:0.76-0.89μm。这些带在光学系统中被二向色棱镜分开。每个传感器具有交错排列的Si p-n-p埋入式光电二极管布局,以及用于防起霜和电子快门操作的溢出漏极。多光谱带(MU)的传感器具有2个CCD,而全色带(PA)的传感器具有4个CCD,以降低工作频率。为了防止Mu4波段(这是一个近红外区域)的调制传递函数(MTF)退化,我们在p $ + $ PLU $ /外延晶片上使用了交错排列和p $ + $ MIN $ /。 Mu4频段的MTF在奈奎斯特频率(fn)和$ HLF fn分别为0.62和0.80。我们开发了新颖的包装技术,以使焦平面平整度峰峰值小于10μm。这些技术包括新开发的SiC-Al $ -2 $ / O $ -3 $ /-SiC封装和一种校正芯片表面翘曲的方法。 !4

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