首页> 外文会议>Electron Devices Meeting, 1995., International >A novel 0.25 /spl mu/m CMOS technology for 6.82 /spl mu/m/sup 2/ 6-Tr. SRAM cell with elevated trench isolation and line-and-space shaped gates (ETILS)
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A novel 0.25 /spl mu/m CMOS technology for 6.82 /spl mu/m/sup 2/ 6-Tr. SRAM cell with elevated trench isolation and line-and-space shaped gates (ETILS)

机译:适用于6.82 / spl mu / m / sup 2 / 6-Tr的新型0.25 / spl mu / m CMOS技术。具有提高的沟槽隔离和线形和间隔形栅极(ETILS)的SRAM单元

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摘要

Miniaturization of SRAM cell size is a key issue for multi-media logic CMOS LSIs, such as DSP and MPEG2 decoders/encoders. Recently, several CMOS technologies realizing small cell size less than 10 /spl mu/m/sup 2/ have been reported, while the previous work by M. Minami et al. (1995) achieved an even smaller cell size of 6.93 /spl mu/m/sup 2/, but this process required two-level local-interconnect. In this paper, a novel 0.25 /spl mu/m CMOS technology is developed by an elevated trench isolation technology and line-and-space shaped gate formation (ETILS). This process allows the smallest cell size of 6.82 /spl mu/m/sup 2/ with simple single-level local-interconnect.
机译:SRAM单元尺寸的小型化是多媒体逻辑CMOS LSI(例如DSP和MPEG2解码器/编码器)的关键问题。最近,已经报道了几种实现小单元尺寸小于10 / spl mu / m / sup 2 /的CMOS技术,而M. Minami等人先前的工作是。 (1995年)实现了甚至更小的单元大小,为6.93 / spl mu / m / sup 2 /,但是此过程需要两级本地互连。在本文中,一种新型的0.25 / spl mu / m CMOS技术是通过一种先进的沟槽隔离技术和线与空间形状的栅极形成(ETILS)开发的。此过程允许通过简单的单级本地互连实现最小的单元大小为6.82 / spl mu / m / sup 2 /。

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