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A Framework for Semi-Automated Fault Detection Configuration with Automated Feature Extraction and Limits Setting

机译:具有自动特征提取和限制设置的半自动故障检测配置框架

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In today’s microelectronics manufacturing facilities, fault detection (FD) is pervasive as the primary advanced process control (APC) capability in use. The current approach to FD, while effective, has a number of shortcomings that impact its cost and effectiveness. The highest among these is the cost in time and resources associated with the largely manual methods used for partitioning and extraction of features of interest in individual traces. Additionally, once these features are extracted, feature-based univariate analysis (UVA) is the primary method used for process monitoring and FD, which fails to incorporate process variable correlations in detecting faults and quality issues. On the other hand, current multivariate analysis (MVA) approaches, such as principal component analysis (PCA), partial least squares (PLS), and their variants, focus on threshold setting in a multivariate space so that they cannot provide direct limit settings on raw (sensor) parameters for decision-making support during online process monitoring. Also, in bypassing feature identification and extraction, the subject matter expert (SME) is largely left out of the loop in MVA analysis; thus, information on the relationship between univariate features and faults is not captured. Furthermore, it is difficult to visualize and understand multivariate limits due to the high dimensionality of the data produced in microelectronics manufacturing processes. Finally, slow and normal process changes often occur in real processes, which can lead to false alarms during implementation when using models trained from offline samples. Thus, a need exists for an FD method that leverages the existing feature-based UVA and provides (1) a method for automated signal partitioning and feature extraction that allows for SME input, (2) an MVA mechanism which considers correlation among parameters and is adaptive to the normal process drift, (3) an automatic approach for limiting UVA features that captures the correlation among parameters, and (4) a methodology for easily viewing these capabilities so that an SME is able to view, understand, and continue to contribute to the FD optimization process. This capability has been developed and successfully applied to microelectronics manufacturing data sets and is proposed as a key component to future microelectronics smart manufacturing systems.
机译:在当今的微电子制造工厂中,故障检测(FD)广泛用作主要的高级过程控制(APC)功能。当前的FD方法虽然有效,但存在许多缺点,影响其成本和有效性。其中最高的是与用于分割和提取单个迹线中的关注特征的手动方法相关的时间和资源成本。此外,一旦提取了这些特征,基于特征的单变量分析(UVA)是用于过程监控和FD的主要方法,该方法无法将过程变量的相关性纳入检测故障和质量问题中。另一方面,当前的多变量分析(MVA)方法(例如主成分分析(PCA),偏最小二乘(PLS)及其变体)集中在多变量空间中的阈值设置上,因此它们无法在原始(传感器)参数,可在在线过程监控期间提供决策支持。同样,在绕过特征识别和提取时,主题专家(SME)在MVA分析中很大程度上被排除在循环之外。因此,没有捕获有关单变量特征和故障之间关系的信息。此外,由于微电子制造过程中产生的数据的高维度,因此很难可视化和理解多元限制。最后,缓慢而正常的过程更改通常会在实际过程中发生,当使用从脱机样本训练而来的模型时,可能会在实施过程中导致错误警报。因此,需要一种利用现有基于特征的UVA的FD方法,并提供(1)一种允许SME输入的自动信号划分和特征提取方法,(2)一种MVA机制,该机制考虑参数之间的相关性,并且(3)限制UVA功能的自动方法,可捕获参数之间的相关性;(4)轻松查看这些功能的方法,以便SME能够查看,理解并继续做出贡献FD优化过程。此功能已经开发并成功应用于微电子制造数据集,并被提议作为未来微电子智能制造系统的关键组件。

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