Experimental Investigation on Thermocouple Attachment Methods for Reliable Temperature Measurement

摘要

Reliable temperature measurement is important for the definition of robust process parameters in industrial soldering of electronics components. At the same time thermal damage of the components has to be averted and high soldering quality has to be provided. The temperature measurement is commonly done by attaching thermocouples to the substrate and a tracking the temperature with a profiling system. The method of attaching the thermocouples to the substrate has an impact on the reliability of the measurement. In this paper the reliability of temperature measurements with thermocouples is investigated by means of factorial design of experiments. It was found that method showed the most reliable measurement results in this study.