Complex Integrated Circuits ESD Damage Diagnosis Technology and Application

摘要

ESD damage location and diagnosis is a difficult technology for complex IC chips. This study introduces several techniques of ESD damage location, diagnosis and analysis for complex chips, including conventional analysis techniques such as optical microscopy and scanning electron microscopy, as well as advanced analysis techniques such as low light detection, hot spot analysis and magnetic induction imaging analysis. It also introduces the method, process and identification method of IC chip damage diagnosis. Some practical cases show the application of ESD damage location diagnosis technology, which has important guiding significance for the design, manufacture, assembly, application and failure analysis of complex integrated circuits.