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Corrosion in Liquid Cooling Systems with Water-Based Coolant – Part 1: Flow Loop Design for Reliability Tests

机译:带水基冷却剂的液体冷却系统中的腐蚀–第1部分:可靠性测试的流量环设计

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With increasing thermal loads in electronic packages, liquid cooling is a preferred option for superior cooling capability. Closed loop liquid cooling systems with microchannel cold plates have demonstrated superior thermal performance. The widespread adaptation of this technology, however, is subject to long term reliability concerns, especially caused by corrosion with a water-based coolant. Galvanic corrosion, which is caused by the difference in electrode potentials is observed to be the dominant failure mechanism. In this paper, the design and development of flow loops suitable for capturing the corrosion behavior within the loop is discussed. Careful consideration of all components within the loop and the rationales behind the choices are highlighted. The experimental methodology details various sensors and measurements required to assess corrosion development in the loop. Experimental results from the flow loop tests are presented and engineering recommendations are made for flow loop design, choice of working fluid and measurements to be made in-situ. Although there is a clear indication of corrosion progression based on the experimental data of fluid chemistry degradation, no significant impact is observed on thermal performance of the current microchannel cold plate design for the duration of the current test conditions.
机译:随着电子封装中热负荷的增加,液体冷却是实现卓越冷却能力的首选。具有微通道冷却板的闭环液体冷却系统已显示出卓越的热性能。但是,这项技术的广泛应用受到长期可靠性的关注,特别是由水基冷却剂腐蚀引起的。观察到由电极电位差异引起的电偶腐蚀是主要的失效机理。在本文中,讨论了适用于捕获环流内腐蚀行为的流环的设计和开发。强调了对循环中所有组件的仔细考虑以及选择背后的原理。实验方法学详细介绍了评估环路腐蚀发展所需的各种传感器和测量。提出了流动回路测试的实验结果,并提出了有关流动回路设计,工作流体选择和现场测量的工程建议。尽管根据流体化学降解的实验数据可以清楚地表明腐蚀的进程,但是在当前测试条件下,对当前微通道冷板设计的热性能没有观察到明显的影响。

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