Development of Sheet Type Molding Compounds for Panel Level Package

摘要

Wafer Level Package (WLP) has been widely and commonly used in the electronics market, and getting more popular due to its advantages [1]. Liquid molding compound is a major encapsulation for the package. Panel Level Package (PLP) is considered as one of the next solutions after WLP because of more efficient and effective productivity with bigger panel size than WLP [2] [3]. At the moment, granule encapsulation with Compression Mold (CM) process is a major trend for PLP, however in this paper, we will discuss sheet type molding compound (mold sheet) for PLP as an alternative encapsulation material other than granule types. Same as WLP approach, the warpage is the main topic in PLP approach. Therefore, the warpage is key discussion in this paper, but Tg, Storage Modulus (E'), Co-efficient of Thermal Expansion (CTE) of Mold Sheet and Glass Carrier are also discussed. Among a lot of parameters, difference of raw materials, solid or liquid, made the biggest impact to warpage. This might be due to difference of capacity for filler content. Making from solid resin can accept more filler than making from liquid resin, which makes CTE of mold sheet much lower. It is expected that Various Mold sheets with Glass carriers combination make more flat products, and we considered about relation between various items.