Orthogonal Quilt Packaging 3D Integration for High-Energy Particle Detectors

摘要

This paper presents Quilt Packaging® (QP), a chip edge-interconnect technology to provide solutions for applications in which multi-chip 3D assemblies are the optimal configuration, but stacking approaches are not desirable. We present an overview of an orthogonal multi-chip system enabled by QP chip integration technology, including verification of the chip-to-chip interconnects and QP’s compatibility with CMOS, along with fabrication results and testing of the 3D assembly. We then extend this approach to the unique challenge of deep pixel high-energy particle detectors for scientific applications.