High Performance Lightweight Ceramic Material for Thermal Management in Electronic Devices

摘要

High performance thermally conductive, light-weight and low coefficient of thermal expansion materials are desired in novel thermal management designs for dissipating heat more efficiently in today’s high power density electronic devices. Hexagonal boron nitride (h-BN) is a unique synthetic light-weight high performance thermally conductive ceramic material with excellent electrical insulation. h-BN has proven to be one of the most attractive fillers for improving thermal conductivity while maintaining the electrical insulation of polymeric thermal interface materials (TIM) and thermally conductive plastics (TCPs) used in electronic devices.