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Integration of Two-Dimensional MEMS Ultrasonic Transducer Arrays with Front-End Electronics for Medical Ultrasound Imaging

机译:二维MEMS超声换能器阵列与用于医学超声成像的前端电子设备的集成

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Electrostatically actuated MEMS ultrasonic transducers, also known as Capacitive Micromachined Ultrasonic Transducers (CMUTs), offer better performance with respect to conventional piezoelectric transducers in terms of bandwidth and efficiency. The enhanced compatibility between MEMS and standard integrated circuit technologies enables the integration of the transducer and the front-end electronics, and is currently leveraged in the development of new-generation diagnostic systems for clinical, emergency and point-of-care uses. This paper reports on the development of an integrated 2-D CMUT array designed for volumetric ultrasound imaging. An acoustically optimized 3-D packaging technology has been applied to the design, fabrication and characterization of a Multi-Chip Module (MCM) obtained by 3-D interconnection of a 256-element CMUT spiral array and a 256-channel analog front-end Application Specific Integrated Circuit (ASIC) with integrated pulsers, low-noise receivers and a programmable TX beamformer.
机译:静电驱动的MEMS超声换能器,也称为电容式微机械超声换能器(CMUT),在带宽和效率方面都比传统的压电换能器提供更好的性能。 MEMS和标准集成电路技术之间增强的兼容性实现了传感器与前端电子设备的集成,并且目前被用于开发用于临床,急诊和即时护理的新一代诊断系统。本文报告了为体积超声成像而设计的集成二维CMUT阵列的开发情况。经过声学优化的3D封装技术已应用于通过256元素CMUT螺旋阵列和256通道模拟前端的3D互连而获得的多芯片模块(MCM)的设计,制造和表征。具有集成脉冲发生器,低噪声接收器和可编程TX波束形成器的专用集成电路(ASIC)。

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