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IN SITU ANALYSIS OF DEFORMATION MECHANICS OF CONSTRAINED CUTTING TOWARDS ENHANCED MATERIAL REMOVAL

机译:受限材料向增强材料去除的变形机理的原位分析

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Chip formation in conventional cutting occurs by deformation that is only partially bounded by the cutting tool. The unconstrained free surface is a complication in determining the deformation of chip formation. The constrained cutting employs a constraining tool in the cutting process to confine the otherwise free surface and enable direct control of the chip formation deformation. A study has been made on the deformation mechanics of plane-strain constrained cutting using high speed imaging and digital image correlation (DIC) methods. For different constrained levels (including unconstrained free cutting), material flow of chip formation is directly observed; strain rate and strain in the chip as well as the subsurface region are quantified; cutting forces are measured; and surface finish are examed. The study shows that chip formation in constrained cutting can occur in two different deformation modes, i.e., simple shear and complex extrusion, depending on the constrained level. Constrained cutting in simple shear regime can reduce strain, reduce cutting force and energy, and improve surface finish compared to free cutting, therefore it is more efficient for material removal than free cutting. Constrained cutting in the complex extrusion regime imposes a significant amount of surface / subsurface deformation and consumes a very high cutting energy, and therefore is not suitable for material removal. Furthermore, the mechanics of chip formation in both free cutting and constrained cutting, especially the roles played by the free surface and the constraining tool, are discussed.
机译:传统切削中的切屑形成是通过仅由切削工具部分限制的变形而发生的。无约束的自由表面是确定切屑形成的变形的复杂因素。约束切削在切削过程中采用约束工具来约束原本自由的表面,并能够直接控制切屑形成的变形。利用高速成像和数字图像相关(DIC)方法对平面应变约束切削的变形力学进行了研究。对于不同的约束水平(包括无约束的自由切削),可以直接观察到切屑形成的物料流;量化芯片中的应变率和应变以及地下区域;测量切削力;和表面光洁度进行检查。研究表明,在受限切削条件下,切屑的形成可以以两种不同的变形模式发生,即简单剪切和复杂挤压。与自由切割相比,在简单的剪切状态下约束切割可以减少应变,降低切割力和能量,并改善表面光洁度,因此与自由切割相比,材料去除效率更高。在复杂的挤压方式下,受约束的切割会产生大量的表面/亚表面变形,并消耗很高的切割能量,因此不适合用于材料去除。此外,还讨论了在自由切削和约束切削中切屑形成的机理,特别是自由表面和约束工具所起的作用。

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