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Additive Manufacturing of Micro-scale Tunnels on a Silicon Substrate with in-situ UV LED Curing for MEMS Applications

机译:具有用于MEMS应用的原位UV LED固化的硅基板上的微型隧道的增材制造

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The present study aims to develop an alternative approach to form quasi-cylindrical micro-scale tunnels on a silicon substrate using additive manufacturing technologies. A UV curable polymer is line-printed on the surface of a silicon wafer by needle dispensing. A tail-like thin metal wire is fixed at the needle tip and travels with the needle in order to form a hollow tunnel-like structure. A UV LED light source is integrated for in-situ curing so that the geometry of hollow polymeric tunnel can be preserved without collapse. The inner diameter of the formed quasicylindrical tunnel is at the order of 100 micron.
机译:本研究旨在开发一种替代方法,利用增材制造技术在硅衬底上形成准圆柱形微型隧道。通过针头分配将紫外线可固化聚合物线型印刷在硅晶片的表面上。尾状的细金属丝固定在针尖处,并与针一起移动,以形成空心的隧道状结构。集成了一个UV LED光源以进行原位固化,因此可以保留空心聚合物通道的几何形状而不会塌陷。所形成的准工业隧道的内径约为100微米。

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