A New Single In-line Package of Intelligent Power Modules for low power Motor Drive Applications

摘要

A new SIP (Single In-line Package) IPM (intelligent Power Module) is a fully optimized inverter module for industrial motor drive applications. The size of the module is smaller than that of conventional SIP products of ON Semiconductor while keeping equivalent performance and reliability. Adoption of FS3 IGBTs and high performance FRDs improves the module performance. A built-in HVIC and bootstrap diodes are highly integrated with power components in one module, which enables to create the PCB layout simpler and easier. A new SIP IPM with the full mold type substrate enhances the cost effectiveness. Moreover, a DBC (Direct Bonded Copper) substrate will provide a technical advantage to further improve the performance in the future. This paper explains about electrical characteristics, circuit configurations, package technology, thermal performance and power rating of the improved new SIP IPM