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Enhanced dielectric properties and thermal conductivity of sandwich-structured PVDF composites by spin coating

机译:通过旋涂增强三明治结构的PVDF复合材料的介电性能和导热性

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Polymeric dielectric composites with high thermal conductivity have played an important role in modern society because of their significant applications in the fields of sensing and energy storage. The combination of the use of various dimensions fillers and surface modification to prepare high thermal conductivity and high dielectric permittivity composite materials has attracted great attention. Poly(vinylidene fluoride) (PVDF), in general, has acted as basis materials to prepare dielectric materials due to its high permittivity and favorable flexibility. In this study, the modified BN (m-BN) was prepared by coating with polydopamine (PDA) to improve the compatibility and reduce the interfacial thermal resistance. Meanwhile, MWCNT grafted with PAAc named m-MWCNT was also used. The novel sandwich-structured PVDF nanocomposites with m-BN fillers in the outer PVDF layers and m-MWCNT in the middle PVDF layer were prepared by spin-coating. Results shown that the optimized sandwiched structure of PVDF composite with 20 wt% m-BN fillers in the outer layers and 2% m-MWCNT in the middle layer displays a high thermal conductivity of 3.5 W m-1K-1 (three times of that of single layer). The dielectric constant of sandwiched structure PVDF composite is 17, which is about 190% times higher than that of PVDF/m-BN (single layer). These enhancements in dielectric properties may be attributed to m-MWCNT and Maxwell-Wagner interfacial polarization which was generated from the multi-layers structure. The mechanism is further explored.
机译:具有高导热性的聚合物介电复合材料由于在传感和能量存储领域的重要应用,在现代社会中发挥了重要作用。各种尺寸填料的使用和表面改性相结合以制备高导热率和高介电常数的复合材料引起了极大的关注。通常,聚偏二氟乙烯(PVDF)由于其高介电常数和良好的柔韧性而已用作制备介电材料的基础材料。在这项研究中,改性的BN(m-BN)是通过用聚多巴胺(PDA)涂覆制备的,以提高相容性并降低界面热阻。同时,还使用了接枝有PAAc的MWCNT,称为m-MWCNT。通过旋涂制备了新型的三明治结构的PVDF纳米复合材料,其在外PVDF层中具有m-BN填料,在中PVDF层中具有m-MWCNT。结果表明,外层含20 wt%m-BN填料,中层含2 wt%m-MWCNT的PVDF复合材料的优化夹层结构具有3.5 W m -1 的高导热率。 sup> K -1 (单层的三倍)。夹层结构PVDF复合材料的介电常数为17,比PVDF / m-BN(单层)的介电常数高约190%。介电性能的这些增强可归因于由多层结构产生的m-MWCNT和Maxwell-Wagner界面极化。进一步探讨该机制。

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