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Simulation of metallic enclosures with apertures on electrical shielding effectiveness

机译:模拟带孔的金属外壳的电屏蔽效果

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Electromagnetic shielding of metallic enclosures with an aperture is simulated by means of COMSOL in this paper. The effect of the polarization type, the thickness of material and material type on electrical shielding effectiveness has been investigated to give suggestions to enclosure designers to get better performance against to EMI. It is obtained that locating rectangular aperture in vertical position with respect to the direction of source results in better electrical shielding performance. Performance of an enclosure whose thickness is about a skin depth is 6dB worse than the enclosure whose thickness is in the order of five times skin depth. As expected, higher conducting materials need to be preferred rather than poor one. Silver, aluminum, cupper and chrome are in the order of better to worst.
机译:本文利用COMSOL对带孔金属外壳的电磁屏蔽进行了仿真。研究了极化类型,材料的厚度和材料类型对电屏蔽效率的影响,为外壳设计人员提供了一些建议,以使其具有更好的抗EMI性能。可以将矩形孔相对于源的方向定位在垂直位置会产生更好的电屏蔽性能。厚度约为趋肤深度的外壳的性能比厚度约为趋肤深度的五倍的外壳的性能差6dB。不出所料,需要使用高导电材料而不是劣质材料。银,铝,铜和铬的顺序从好到坏。

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