This paper provides an overview of the various steps required for the optimization of several parameters: friability and strength when dealing with powdered PLA-based green (VOC-free) adhesives. Various approaches to tailor and appropriately select a useful adhesive formulation have been presented. These approaches included: thermal exposure, hydrolysis, and ionizing radiation types inclusive of Co-60 photons and 10 MeV electrons. Methods for characterizing changes for each method were also presented with a corresponding property response in each case. Samples of 3-ply plywood were prepared and demonstrated to have acceptable levels of substrate failure, and resistance to water-soaking.
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