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Profiling Attack on Modular Multiplication of Elliptic Curve Cryptography

机译:椭圆曲线密码模乘的性能分析攻击

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Security of embedded devices is a constant challenge due to the development of new and powerful side-channel attack techniques. This paper proposed a new profiling method to attack ECC implementation with combing method, which utilizes the leakage of modular multiplication during adding operations on points. We analyze the decryption of SM2 in a smart IC card with Riscure's platform, and present how to improve the SNR of the power traces during real attack situation. Experiment results show that the maximum success rate of template matching can reach to 100%, which means if an adversary gets the template data he can easily recover the 256-bits private key of SM2 by measurement only one trace, which means key blinding can't defend this attack.
机译:嵌入式设备的安全性是不断发展的挑战,这归因于新的强大的旁通道攻击技术的发展。提出了一种新的剖析方法,利用梳理方法攻击ECC实现,该方法利用了对点进行加法运算时模块乘法的泄漏。我们使用Riscure的平台分析了智能IC卡中SM2的解密,并提出了在实际攻击情况下如何提高功率迹线的信噪比。实验结果表明,模板匹配的最大成功率可以达到100%,这意味着如果对手获取模板数据,他只需测量一条迹线就可以轻松地恢复SM2的256位私钥,这意味着密钥盲化可以做到。保卫这次袭击。

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