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The characterization of copper oxide with different molar concentration using sol-gel spin coating

机译:溶胶-凝胶旋涂法表征不同摩尔浓度的氧化铜

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The objective of this research is to evaluate the effect of different molar concentration of the copper oxide (CuO) thin films deposited using spin-coating technique. The CuO thin films were deposited on 500μm quartz substrates. The molar concentration of CuO solutions used were 0.3M, 0.35M, 0.4M, 0.45M and 0.5M were prepared using sol-gel method. These solutions were formed by dissolving copper acetate powder into isopropanol, diethanolamine and polyethylene glycol. All samples were annealed at 600°C for 1 hour in a furnace. The electrical properties were measured by two point probe to check thin film resistivity. The electrical measurements showed that current increased with the concentration. The thicknesses were performed using the surface profiler while the surfaces morphology were characterized using Field Emission Scanning Electron Microscopy (FESEM). The films surfaces were smooth with uniformly distributed grains. The optical transmittances were measured using UV-Vis spectrometer and the reading decreased with concentration.
机译:这项研究的目的是评估使用旋涂技术沉积的不同摩尔浓度的氧化铜(CuO)薄膜的影响。 CuO薄膜沉积在500μm石英基板上。使用溶胶-凝胶法制备的CuO溶液的摩尔浓度为0.3M,0.35M,0.4M,0.45M和0.5M。这些溶液是通过将乙酸铜粉末溶解在异丙醇,二乙醇胺和聚乙二醇中形成的。将所有样品在炉中在600℃下退火1小时。通过两点探针测量电性能以检查薄膜电阻率。电学测量表明电流随着浓度的增加而增加。使用表面轮廓仪进行厚度测量,同时使用场发射扫描电子显微镜(FESEM)表征表面形态。薄膜表面光滑,颗粒均匀分布。使用UV-Vis光谱仪测量光学透射率,并且读数随浓度降低。

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