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Investigations in selective laser melting as manufacturing technology for the production of high-temperature mechatronic integrated devices

机译:选择性激光熔化作为高温机电一体化器件生产的制造技术的研究

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Additive manufacturing (AM) has the potential to lead significant changes in the present state-of-the-art production processes. This provides tool-free and direct manufacturing of complex geometries simultaneously integrating various functions into components. Though AM techniques are widely used in various sectors, the applicability into electronics production has been not yet explored. In this paper, the results of the investigations towards additive manufacturing technology namely `Selective Laser Melting (SLM)' used to produce ceramic substrates for high temperature electronic applications are summarized. This paper introduces a new substrate production technology consisting of a ceramic base with additively constructed metal conductive patterns through SLM. The process flow and the influential factors are discussed. Preliminary results in the development of demonstrator and soldering of electronics components are also summarized.
机译:增材制造(AM)可能会导致当前最先进的生产工艺发生重大变化。这提供了无需工具且直接制造复杂几何形状的功能,同时将各种功能集成到了组件中。尽管增材制造技术已广泛应用于各个领域,但尚未探索其在电子产品生产中的适用性。在本文中,总结了对用于制造用于高温电子应用的陶瓷基板的“增材制造技术”(即“选择性激光熔化(SLM)”)的研究结果。本文介绍了一种新的基板生产技术,该技术包括通过SLM通过陶瓷基体和可叠加构造的金属导电图案组成的陶瓷基体。讨论了工艺流程及其影响因素。还总结了演示器开发和电子元件焊接的初步结果。

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