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The effect of dressing parameters on the chip loading and ground surface quality by using grinding pins and grinding wheels with very fine grits

机译:用磨削销和磨削轮毂磨削参数对芯片加载和地面质量的影响,用非常细砂浆

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Dressing as an integrated part of the grinding process influences the quality of ground surface and the loading of the grinding tool. This paper addresses the effect of dressing parameters, including the different dressing overlapping ratios (severely high values) and dressing speed ratios (up and down dressing modes) on the chip loading and surface finish in the grinding with micro-pins and grinding wheels with very fine grits. The results revealed that both the ground surface quality and chip loading are significantly influenced by the grinding tool topography which is generated by the dressing process. The very high dressing overlapping ratios generated a fine topography on the grinding tool, which resulted in lower chip loading and finer surface finish. Moreover, both chip nests and welded clogging on the grinding grains were observed. More welded clogging of the grinding pin was detected when the dressing overlapping ratio decreased and down dressing mode was applied. Mirror surface quality (Ra=0.035) was achieved with utilizing overlapping ratios up to 60 for a grinding wheel with grits size #500.
机译:作为磨削过程的集成部分敷料影响地面的质量和研磨工具的装载。本文解决了敷料参数的效果,包括在芯片装载和表面饰面中的不同敷料重叠比率(严重高值)和敷料速度比(上下敷料模式),用微引脚和磨削轮磨损细粒。结果表明,地面质量和芯片加载都受到穿敷料过程产生的研磨工具形貌的显着影响。非常高的敷料重叠比率在研磨工具上产生了精细的地形,从而导致芯片加载和更精细的表面光洁度。此外,观察到砂粒上的芯片嵌套和焊接堵塞。当敷设重叠率下降和敷料模式时,检测到磨销的更多焊接堵塞。利用带有砂轮的重叠比率,实现镜面质量(RA = 0.035),用于砂轮与砂轮尺寸#500。

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