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Anomalous process temperature scaling behavior of sol-gel ZrOx gate dielectrics: Mobility enhancement in ZnO TFTs

机译:溶胶-凝胶ZrO x 栅极电介质的异常过程温度缩放行为:ZnO TFT中的迁移率增强

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Solution-processed transparent conductive oxides have emerged as an attractive material system for realization of large-area and flexible electronic systems, where the scalability of solution-processing offers potential advantages [1]. Recently, the performance of solution-processed ZnO thin-film transistors (TFTs) deposited via spray pyrolysis at 400°C has become comparable to sputtering with a competitive mobility of 85 cm/Vs on a sol-gel ZrO gate dielectric [2]. Similar results such as these have been obtained in other TCO material systems by exploiting the commonly observed yet unexplained phenomena of mobility enhancement due to high-k dielectrics. [3] While many of these results have been obtained at process temperatures of >500°C, there is particular interest in lowering the process temperatures to expand the range of compatible substrates. We have investigated the impact of lowering the deposition temperature of sol-gel ZrO dielectrics [4] on the electrical performance of ZnO TFTs processed at a low temperature of 250°C using a spray pyrolysis technique [2]. Surprisingly, and potentially of tremendous advantage, transistor performance improved dramatically as the processing temperature of the ZrO was reduced.
机译:固溶处理的透明导电氧化物已经成为一种有吸引力的材料系统,可用于实现大面积和灵活的电子系统,固溶处理的可扩展性具有潜在的优势[1]。最近,通过在400°C的喷雾热解沉积的固溶处理的ZnO薄膜晶体管(TFT)的性能已变得与在溶胶-凝胶ZrO栅极电介质上具有85 cm / Vs的竞争迁移率的溅射具有可比性[2]。通过利用通常观察到的由于高k介电常数导致的迁移率增强现象,在其他TCO材料系统中也获得了类似的结果。 [3]尽管许多这些结果是在> 500°C的处理温度下获得的,但特别令人关注的是降低处理温度以扩大兼容基板的范围。我们已经研究了降低溶胶-凝胶ZrO电介质的沉积温度[4]对使用喷雾热解技术在250°C的低温下处理的ZnO TFT的电性能的影响[2]。出乎意料的并且潜在地具有巨大优势,随着ZrO的处理温度降低,晶体管性能得到了显着改善。

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