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Study of RF breakdown and multipacting in accelerator components

机译:加速器组件中的射频击穿和多步脉冲研究

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Radio frequency (RF) structures that are part of accelerators and energy sources, operate with sinusoidally varying electromagnetic fields under high RF energy. Here, RF breakdown and multipacting take place in RF structures and limit their performance Electron field emission processes in a RF structure are precursors for breakdown processes. RF breakdown is a major phenomena affecting and causing the irreversible damage to RF structures. Breakdown rate and the damage induced by the breakdowns are its important properties. The damage is related to power absorbed during breakdown, while the breakdown rate is determined by the amplitudes of surface electric and magnetic fields, geometry, metal surface preparation and conditioning history. It limits working power and produces irreversible surface damage. The breakdown limit depends on the RF circuit, structure geometry, RF frequency, input RF power, pulse width, materials used, surface processing technique and surface electric and magnetic fields. Multipactor (MP) is a low power, electron multiplication based resonance breakdown phenomenon in vacuum and is often observed in RF structures. A multipactor discharge is undesirable, as it can create a reactive component that detunes the resonant cavities and components, generates noise in communication system and induces gas desorption from the conductor surfaces. In RF structures, certain conditions are required to generate multipacting.
机译:作为加速器和能源一部分的射频(RF)结构在高RF能量下以正弦变化的电磁场运行。此处,RF击穿和多行同步发生在RF结构中,并限制了它们的性能RF结构中的电子场发射过程是击穿过程的先兆。射频击穿是影响射频结构并造成不可逆转损坏的主要现象。击穿率和击穿引起的损坏是其重要特性。损坏与击穿过程中吸收的功率有关,而击穿率则取决于表面电场和磁场的幅度,几何形状,金属表面处理和处理历史。它会限制工作功率并产生不可逆的表面损坏。击穿极限取决于射频电路,结构几何形状,射频频率,输入射频功率,脉冲宽度,使用的材料,表面处理技术以及表面电场和磁场。 Multipactor(MP)是一种低功率,基于电子倍增的真空中的共振击穿现象,通常在RF结构中观察到。多重放电是不希望的,因为它会产生一个反应成分,从而使谐振腔和成分失谐,在通信系统中产生噪声,并导致气体从导体表面解吸。在RF结构中,需要某些条件才能生成多步。

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