首页> 外文会议>Annual IEEE Applied Power Electronics Conference and Exposition >System in Package with Mounted Capacitor for Reduced Parasitic Inductance in Voltage Regulators
【24h】

System in Package with Mounted Capacitor for Reduced Parasitic Inductance in Voltage Regulators

机译:具有安装电容器的封装中的系统,用于降低蓄电电压电压电感

获取原文

摘要

A system in package (SiP) on which an input capacitor is mounted has been developed for voltage regulators. The SiP offers the world's lowest power dissipation of 3.8 W at 1 MHz. Its parasitic inductance is 44% lower than SiPs with the input capacitor mounted on the PCB, due to a small loop from the input capacitor to the MOSFETs, which reduces power dissipation by 25% at the same peak voltage. The high-side MOSFET die is flipped so that the drain electrode faces up, facilitating the connection of the MOSFET to the input capacitor. The lead frames and MOSFETs are connected with Cu leads, which reduce the spreading resistance of the MOSFET electrodes.
机译:已经开发了一种用于安装输入电容的包装系统(SIP),用于电压调节器。 SIP在1 MHz提供了3.8 W的世界上最低功耗。由于从输入电容到MOSFET的小环路,其寄生电感比安装在PCB上的输入电容低44%,所以由于从输入电容器到MOSFET的小环,这在相同的峰值电压下降低了25%的功率耗散。高侧MOSFET管芯被翻转,使得漏电极面向上,便于MOSFET的连接到输入电容器。引线框架和MOSFET与Cu引线连接,这减小了MOSFET电极的扩展电阻。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号