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In situ spectroscopic ellipsometry of SIS barrier formation

机译:SIS屏障形成的原位光谱椭圆形测定法

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First reported by our research group in 2007, AlN tunnel barriers grown by ICP nitridation of thin Al overlayers offer a promising alternative to Al oxide barriers for high current density SIS junctions used in quantum limited THz heterodyne receivers [1]. However, the growth rate of AlN is heavily dependent on ICP operating conditions and as new uncharacterized nitridation processes are investigated, knowledge of the barrier thickness is integral to realizing SIS junctions of desired current density, which is exponentially dependent upon barrier thickness. An in situ method for real time monitoring of ICP AlN growth on thin Al overlayers through the use of spectroscopic ellipsometry and a correlation of the determined AlN thickness to the normal resistance area product (RA) of the resulting trilayer is reported.
机译:我们的研究小组于2007年报道,由ICP硝化的ALN隧道屏障薄层覆盖者提供了对Quantum Limited THz外差接收器中使用的高电流密度SIS连接的高电流密度SIS连接的替代方案。 然而,ALN的生长速率严重依赖于ICP操作条件,并且在研究新的无特征化氮化过程中,对屏障厚度的知识是实现所需电流密度的SIS连接的一体,这是指数依赖性的屏障厚度。 据报道,通过使用光谱椭圆形测定,对薄Al重叠体的ICP Aln生长的实时监测ICP Aln生长的原位方法及所得的ALN厚度与所得三层的正常电阻区域产品(Ra)的相关性。

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