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Circuit optimization of 4T, 6T, 8T, 10T SRAM bitcells in 28nm UTBB FD-SOI technology using back-gate bias control

机译:使用背栅偏置控制的28nm UTBB FD-SOI技术中的4T,6T,8T,10T SRAM位单元的电路优化

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SRAM bitcell optimizations have been demonstrated in 28nm High-к Metal Gate UTBB (Ultra-Thin Body and BOX) FD-SOI technology. The back-gate terminal biasing leads to forward or reverse bias of the transistors and has been used to improve the bitcell electrical metrics. The derived 6T bitcell variants show a gain of 67% (25%) in cell current at 0.6V (1V), 45% reduction in write time at 0.6V, along with a gain in either write margin or static noise margin. Two 4T load-less bitcell variants using back-gate bias have been fabricated and compared for performance, power and stability margins. The back-gate biasing concept has been extended to optimize 8T, 10T bitcells and their simulation results are also presented.
机译:SRAM位单元优化已在28nmHigh-к金属栅极UTBB(超薄体和BOX)FD-SOI技术中得到证明。背栅端子偏置导致晶体管的正向或反向偏置,并且已被用于改善位单元的电度量。派生的6T位单元变体在0.6V(1V)时的单元电流中显示67%(25%)的增益,在0.6V时的写入时间减少45%,同时在写裕度或静态噪声容限方面也有所增加。已经制造出两个使用背栅偏置的4T空载位单元变体,并对其性能,功率和稳定性裕度进行了比较。背栅偏置概念已得到扩展,可以优化8T,10T比特单元,并给出了其仿真结果。

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