Impact of Chip-Package-PCB Design on the Optimization of AC/DC Switched Mode Power Supply using Time Domain Analysis

摘要

Over the last few years, state-of-the-art Switched Mode Power Supply (SMPS) topologies like the boost power factor correction have reached system level efficiencies above 95 percent. Therefore, efficiency alone is not a sufficient value proposition for many customers. Instead, aspects like ease-to-use, electromagnetic compatibility, or total power density are gaining importance. Hardware prototyping loops can provide insights and directions for optimization but at the cost of time and characterization effort. In this paper, we present a virtual prototyping framework that can be applied to any state-of-the-art AC-DC converter topology and allows for a multidimensional optimization of the requirements mentioned above. Using coupled time-domain electro-thermal and electromagnetic simulations, we are able to accurately extract operating points under various load conditions for the typical input voltage range of 85-230 VAC. We validate our approach using experimental data on silicon and extend the analysis to any desired combination of wide bandgap semiconductors in state-of-the-art packages. Useful information can also be extracted from the frequency domain, applying FFT transformation to the transient switching waveforms simulated directly. A comparison of conducted EMI spectra is presented for several device technologies/packages and the first correlations are derived.