Characterization of printed circuit board materials manufacturing technologies for high frequency applications up to 110 GHz

摘要

This paper focuses on the description of loss behavior up to 110 GHz for two commercially widely used transmission line modes, microstrip (MS) and conductor backed coplanar waveguide (CBCPW). Within this investigation special attention has been drawn to the applied manufacturing processes as each process has distinct tolerances and etching behavior. The measured data is based on a comparison of 50 Ω transmission lines manufactured on two different substrates and for two structuring processes, pattern plating and panel plating.