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Back-to-back capacitor switching performance of vacuum interrupters after high frequency sub-microsecond voltage impulse conditioning

机译:高频亚微秒电压脉冲调节后真空灭弧室的背对背电容器开关性能

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The objective of this paper is to investigate back-to-back capacitor switching restrike characteristics of vacuum interrupters (VIs) after conditioning by using a series of high-frequency sub-microsecond voltage impulses. 7.2 kV VIs are conditioned by several hundreds of batches of sub-microsecond high voltage impulses (1000Hz, 0.1s). The peak value of each impulse reaches 100kV. If a breakdown occurs under a voltage impulse, a high frequency conditioning current of several kA (peak value) would flow through the VI. Then the back-to-back capacitor switching tests are carried out at the inrush currents with peak values of 2 kA and 5 kA, respectively. The peak value of the recovery voltage reaches about 15 kV. The experimental results show that the restrike probability can be reduced significantly by using this high frequency voltage impulses conditioning method. By using VIs which are not conditioned as a benchmark, the restrike probability of the conditioned VIs is reduced from 17.9% to 9.6% at the inrush current of 2 kA. With a higher inrush current of 5 kA, the restrike probability reaches higher to 30.4% with the no conditioned VIs. However, the restrike probability reduces significantly to 7.9% after the conditioning. For VIs which are conditioned, the contact surfaces are fully covered by the molten metal layer resulting from the conditioning current. The contact welding areas caused by the inrush current are much broader and the depths are much shallower than that of VIs in benchmark.
机译:本文的目的是研究通过使用一系列高频亚微秒电压脉冲进行调理后的真空灭弧室(VIs)的背对背电容器开关重击特性。 7.2 kV VI受数百批亚微秒高压脉冲(1000Hz,0.1s)调节。每个脉冲的峰值达到100kV。如果在电压脉冲下发生击穿,则VI会流过几kA(峰值)的高频调节电流。然后在峰值电流分别为2 kA和5 kA的浪涌电流下进行背对背电容器开关测试。恢复电压的峰值达到约15kV。实验结果表明,使用这种高频电压脉冲调节方法可以显着降低重击几率。通过使用未调节的VI作为基准,在2 kA的浪涌电流下,调节后的VI的重击概率从17.9%降低到9.6%。在较高的5 kA浪涌电流下,无条件VI的重击概率高达30.4%。但是,调节后,重击几率显着降低到7.9%。对于经过调节的VI,接触表面被调节电流产生的熔融金属层完全覆盖。与基准相比,由浪涌电流引起的接触焊接区域要宽得多,深度要浅得多。

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