Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate

摘要

Silicon optical interposers for inter-chip interconnects, integrated with an arrayed laser diode, an optical splitter, silicon optical modulators and germanium photodetectors on a single silicon substrate were demonstrated. A 12.5-Gbps error-free data transmission and 6.6-Tbps/cm² transmission density were achieved.