Electrically conductive adhesive (ECA) processing for shingled modules analyzed by x-ray imaging

摘要

Electrically conductive adhesives (ECAs) are being used in several different PV module architectures, including shingled modules. Presently, there is limited available literature on the failure mechanisms of ECAs. X-ray imaging techniques can image a wider region than that of sample extraction for SEM imaging, while still retaining resolutions down to 0.5 µm/pixel. X-ray projections have been used to study the effect of different ECA application methods and curing conditions on the ECA in a shingled mini-module. It was found that lamination does not affect the ECA, if it has already been cured. Additionally, the cell lay-up step in the shingled module fabrication was found to be the primary cause of voids in the ECA layer.